Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (Endorsed by AENOR in September of 2011.)
Publication date
2011-09-01
Original language
English
Pages
27
Publication date
2011-09-01
Original language
English
Pages
27
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