Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
German title
Montageverfahren für eingebettete Bauteile – Teil 2-602: Leitfaden für gestapelte Elektronikmodule – Verfahren zur Beurteilung der elektrischen Verbindungsfähigkeit zwischen den Modulen
Publication date
2021-08
Original language
German
Pages
12
Publication date
2021-08
Original language
German
Pages
12
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