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Standard [CURRENT]

SN EN IEC 60749-37:2022-11

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes
Publication date
2022-11
Original language
English
Pages
3

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Publication date
2022-11
Original language
English
Pages
3

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