Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
German title
Montageverfahren für elektronische Baugruppen - Teil 4: Oberflächenmontierbare Bauteilgehäuse mit Flächenmatrix - (Lebens-)Dauerprüfungen für Lötverbindungen
Publication date
2014-12
Original language
English
Pages
4
Publication date
2014-12
Original language
English
Pages
4
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Replacement amendments
This document has been modified by: SN EN 62137-4/CORR:2015-02