Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 8: Streifen-Biege-Prüfverfahren zur Messung von Zugbeanspruchungsmerkmalen dünner Schichten
Publication date
2011-05
Original language
German
Pages
18
Publication date
2011-05
Original language
German
Pages
18
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice