Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 10: Druckprüfverfahren an zylinderförmigen Mikroproben für Werkstoffe der Mikrosystemtechnik
Publication date
2011-09
Original language
German
Pages
11
Publication date
2011-09
Original language
German
Pages
11
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