Standard
[CURRENT]
SN EN 61191-3:2017-09
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
- German title
- Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage
- Publication date
-
2017-09
- Original language
-
German
- Pages
- 19
- Publication date
-
2017-09
- Original language
-
German
- Pages
- 19
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