Standard
[CURRENT]
SN EN 60749-14:2003-10
Semiconductor devices - Mechanical and climatic test methods. Part 14: Robustness of terminations (lead integrity)
- German title
- Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren. Teil 14: Festigkeit der Bauelementeanschlüsse (Unversehrtheit der Anschlüsse)
- Publication date
-
2003-10
- Original language
-
German
- Pages
- 18
- Publication date
-
2003-10
- Original language
-
German
- Pages
- 18
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