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Standards Worldwide
Standards Worldwide
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Standard [CURRENT]

SN EN 60749-14:2003-10

Semiconductor devices - Mechanical and climatic test methods. Part 14: Robustness of terminations (lead integrity)

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren. Teil 14: Festigkeit der Bauelementeanschlüsse (Unversehrtheit der Anschlüsse)
Publication date
2003-10
Original language
German
Pages
18

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Publication date
2003-10
Original language
German
Pages
18

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