Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-19: Messverfahren für die Gehäuse- Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung
Publication date
2010-05
Original language
German
Pages
13
Publication date
2010-05
Original language
German
Pages
13
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