Standard
[CURRENT]
PD IEC/TS 62647-4:2018-04-25
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Ball grid array (BGA) re-balling
- Publication date
-
2018-04-25
- Original language
-
English
- Pages
- 44
- Publication date
-
2018-04-25
- Original language
-
English
- Pages
- 44
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