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Standard [CURRENT]

PD IEC/TR 61760-3-1:2022-09-30

Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

Publication date
2022-09-30
Original language
English
Pages
30

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Publication date
2022-09-30
Original language
English
Pages
30

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