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Standard [CURRENT]

OVE EN IEC 61188-6-2:2023-04-01

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) ((IEC 61188-6-2:2021) EN IEC 61188-6-2:2021) (german version)

German title
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 6-2: Anschlussflächen - Beschreibung der Anschlussflächen für die meisten oberflächenmontierbaren Bauelemente (SMD, en: surface mounted components) ((IEC 61188-6-2:2021) EN IEC 61188-6-2:2021) (deutsche Fassung)
Publication date
2023-04-01
Original language
German
Pages
30

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Publication date
2023-04-01
Original language
German
Pages
30

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