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Standard [CURRENT]

OVE EN IEC 60749-37:2024-01-01

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer ((IEC 60749-37:2022) EN IEC 60749-37:2022) (german version)

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes ((IEC 60749-37:2022) EN IEC 60749-37:2022) (deutsche Fassung)
Publication date
2024-01-01
Original language
German
Pages
24

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Publication date
2024-01-01
Original language
German
Pages
24

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