Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016) (german version)
German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 26: Beschreibung und Messverfahren für Mikro-Rillen und Nadelstrukturen (IEC 62047-26:2016) (deutsche Fassung)
Publication date
2017-01-01
Original language
German
Pages
30
Publication date
2017-01-01
Original language
German
Pages
30
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