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Standards Worldwide
Standards Worldwide
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Standard [CURRENT]

OVE EN 61189-3-719:2017-01-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016) (german version)

German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3-719: Prüfverfahren für Verbindungsstrukturen (Leiterplatten) - Überwachung des Widerstands von Einzeldurchkontaktierungen (PTH) bei Temperaturwechselbeanspruchung (IEC 61189-3-719:2016) (deutsche Fassung)
Publication date
2017-01-01
Original language
German
Pages
14

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Publication date
2017-01-01
Original language
German
Pages
14

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