Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016) (german version)
German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-13: Konstruktionsleitfaden für Open-top-Fassungen für Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (FBGA/FLGA) (IEC 60191-6-13:2016) (deutsche Fassung)
Publication date
2017-07-01
Original language
German
Pages
22
Publication date
2017-07-01
Original language
German
Pages
22
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice