Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010) (german version)
German title
Halbleiterbauelemente - Teil 1: Prüfung auf zeitabhängigen dielektrischen Durchbruch (TDDB) bei Isolationsschichten zwischen metallischen Leiterbahnen (IEC 62374-1:2010) (deutsche Fassung)
Publication date
2011-08-01
Original language
German
Pages
18
Publication date
2011-08-01
Original language
German
Pages
18
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