Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006)
German title
Halbleiterbauelemente - Bauteile der Mikrosystemtechnik - Teil 3: Dünnschicht-Standardmikroprobe für die Prüfung der Zugbeanspruchung (IEC 62047-3:2006)
Publication date
2007-03-01
Original language
German
Pages
9
Publication date
2007-03-01
Original language
German
Pages
9
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