Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013) (german version)
German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 11: Prüfverfahren für lineare thermische Ausdehnungskoeffizienten für freistehende Werkstoffe der Mikrosystemtechnik (IEC 62047-11:2013) (deutsche Fassung)
Publication date
2014-06-01
Original language
German
Pages
21
Publication date
2014-06-01
Original language
German
Pages
21
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