Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013) (german version)
German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 11: Messung der Schmelztemperatur und Schmelztemperaturbereiche von Lotlegierungen (IEC 61189-11:2013) (deutsche Fassung)
Publication date
2014-03-01
Original language
German
Pages
17
Publication date
2014-03-01
Original language
German
Pages
17
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice