Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006)
German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 35: Ultraschallmikroskopie für kunststoffverkappte Bauelemente der Elektronik (IEC 60749-35:2006)
Publication date
2007-04-01
Original language
German
Pages
21
Publication date
2007-04-01
Original language
German
Pages
21
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice