Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003)
German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 14: Festigkeit der Bauelementeanschlüsse (Unversehrtheit der Anschlüsse) (IEC 60749-14:2003)
Publication date
2004-08-01
Original language
German
Pages
19
Publication date
2004-08-01
Original language
German
Pages
19
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