Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001)
German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-5: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Feinraster-Ball-Grid-Arrays (FBGA) (IEC 60191-6-5:2001)
Publication date
2002-07-01
Original language
German
Pages
12
Publication date
2002-07-01
Original language
German
Pages
12
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