Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (IEC 60191-6-3:2000)
German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-3: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für QFP-Gehäusemaße (IEC 60191-6-3:2000)
Publication date
2001-08-01
Original language
German
Pages
16
Publication date
2001-08-01
Original language
German
Pages
16
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