Standard
[CURRENT]
NF C96-050-18:2014-02-28
NF EN 62047-18:2014-02-28
Semiconductor devices - Micro-electromechanical devices - Part 18: bend testing methods of thin film materials
- German title
- Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 18: Biegeprüfverfahren für Dünnschichtwerkstoffe
- Publication date
-
2014-02-28
- Original language
-
French
- Pages
- 18
- Publication date
-
2014-02-28
- Original language
-
French
- Pages
- 18
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