Semiconductor devices - Micro-electromechanical devices - Part 12: bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 12: Verfahren zur Prüfung der Biege-Ermüdungsfestigkeit von Dünnschichtwerkstoffen unter Verwendung der Resonanzschwingungen bei MEMS-Strukturen
Publication date
2012-07-01
Original language
French
Pages
35
Publication date
2012-07-01
Original language
French
Pages
35
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