Standard
[CURRENT]
NF C96-022-19/A1:2011-08-01
NF EN 60749-19/A1:2011-08-01
Semiconductor devices - Mechanical and climatic test methods - Part 19: die shear strength
- German title
- Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit
- Publication date
-
2011-08-01
- Original language
-
French
- Pages
- 7
- Publication date
-
2011-08-01
- Original language
-
French
- Pages
- 7
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