Mechanical standardization of semiconductor devices - Part 6-21 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-21 : Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemasse von kleinen Gehäusen (SOP)
Publication date
2011-05-01
Original language
French
Pages
17
Publication date
2011-05-01
Original language
French
Pages
17
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