Mechanical standardization of semiconductor devices - Part 6-19 : measurement methods of package warpage at elevated temperature and the maximum permissible warpage
German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-19 : Messverfahren für die Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung
Publication date
2010-11-01
Original language
French
Pages
16
Publication date
2010-11-01
Original language
French
Pages
16
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice