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Standards Worldwide
Standards Worldwide
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Standard [CURRENT]

NF C96-013-6-19:2010-11-01

NF EN 60191-6-19:2010-11-01

Mechanical standardization of semiconductor devices - Part 6-19 : measurement methods of package warpage at elevated temperature and the maximum permissible warpage

German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-19 : Messverfahren für die Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung
Publication date
2010-11-01
Original language
French
Pages
16

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Publication date
2010-11-01
Original language
French
Pages
16

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