Mechanical standardization of semiconductor devices - Part 6-17 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-17 : Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für gestapelte Gehäuse - Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (P-PFBGA/P-PFLGA)
Publication date
2012-10-01
Original language
French
Pages
31
Publication date
2012-10-01
Original language
French
Pages
31
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