Mechanical standardization of semiconductor devices - Part 4: coding system and classification into forms of package outlines for semiconductor device packages
German title
Meschanische Normung von Halbleiterbauelementen - Teil 4: Codierungssytem für Gehäuse und Eingrunppierung der Gehäuse nach der Gehäuseform für Halbleiterbauelemente
Publication date
2014-08-23
Original language
French
Pages
27
Publication date
2014-08-23
Original language
French
Pages
27
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