Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719 : test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3-719 : Prüfverfahren für Verbindungsstrukturen (Leiterplatten) - Überwachung des Widerstands von Einzeldurchkontaktierungen (PTH - plated-through hole) bei Temperaturwechselbeanspruchung
Publication date
2016-11-05
Original language
French
Pages
16
Publication date
2016-11-05
Original language
French
Pages
16
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