Electronics assembly technology - Part 4: endurance test methods for solder joint of area array type package surface mount devices
German title
Montageverfahren für elektronische Baugruppen - Teil 4: Oberflächenmontierbare Bauteilgehäuse mit Flächenmatrix - (Lebens-)Dauerprüfungen für Lötverbindungen
Publication date
2015-07-10
Original language
French
Pages
46
Publication date
2015-07-10
Original language
French
Pages
46
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