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Standard [CURRENT]

NF C90-708:2010-07-01

NF EN 61191-6:2010-07-01

Printed board assemblies - Part 6: evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

German title
Elektronikaufbauten auf Leiterplatten - Teil 6: Bewertungskriterien für Hohlräume in Lötverbindungen von BGA und LGA und Messmethode
Publication date
2010-07-01
Original language
French
Pages
43

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Publication date
2010-07-01
Original language
French
Pages
43

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