Standard
[CURRENT]
NF C90-700-1-2:2014-10-24
NF EN 61190-1-2:2014-10-24
Attachment materials for electronic assembly - Part 1-2 : requirements for soldering pastes for high-quality interconnects in electronics assembly
- German title
- Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2 : Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage
- Publication date
-
2014-10-24
- Original language
-
French
- Pages
- 28
- Publication date
-
2014-10-24
- Original language
-
French
- Pages
- 28
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice
All transactions are encrypted
Loading recommended items...
Loading recommended items...
Loading recommended items...