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Standard [CURRENT]

IPC TR-486:2001-07-17

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

Publication date
2001-07-17
Original language
English
Pages
51

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Publication date
2001-07-17
Original language
English
Pages
51

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