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IEC 62047-21:2014-06

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 21: Prüfverfahren zur Querkontraktionszahl von Dünnschichtwerkstoffen der Mikrosystemtechnik
Publication date
2014-06
Original language
English, French
Pages
26
Publication date
2014-06
Original language
English, French
Pages
26

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