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IEC 61189-3:2007-10

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

German title
Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
Publication date
2007-10
Original language
English, French
Pages
241
Publication date
2007-10
Original language
English, French
Pages
241

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