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IEC 60749-38:2008-02

Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 38: Soft-Error-Prüfverfahren für Halbleiterbauelemente mit Speicher
Publication date
2008-02
Original language
English, French
Pages
26
Publication date
2008-02
Original language
English, French
Pages
26

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