IEC 60749-37:2022-10

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

German title: Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes
Publication date: 2022-10
Original language: English, French
Pages: 43

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