Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP)
German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-8: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Konstruktionsleitfaden für Glas-Keramik-Quad-Flatpack (G-QFP)
Publication date
2001-08
Original language
English,
French
Pages
22
Publication date
2001-08
Original language
English,
French
Pages
22
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