IEC 60191-6-2:2001-12

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

German title: Mechanische Normung von Halbleiterbauelementen - Teil 6-2: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Konstruktionsleitfaden für Gehäuse mit Kugel- und Säulenanschlüssen in einem Raster von 1,50 mm, 1,27 mm und 1,00 mm
Publication date: 2001-12
Original language: English, French
Pages: 21

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Replacement amendments

This document has been modified by: IEC 60191-6-2 Corrigendum 1:2002-10

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