Standards Worldwide
Standards Worldwide
Phone +49 30 58885700-07

Standard [CURRENT] Article is not orderable

IEC 60191-6-18 Corrigendum 2:2010-07

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Publication date
2010-07
Original language
French
Pages
1
Publication date
2010-07
Original language
French
Pages
1

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Loading recommended items...
Loading recommended items...
Loading recommended items...
Loading recommended items...