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IEC 60191-6-18 Corrigendum 1:2010-05

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-18: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Ball-Grid-Array (BGA)
Publication date
2010-05
Original language
English, French
Pages
1
Publication date
2010-05
Original language
English, French
Pages
1

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