IEC 60191-6-17:2011-01

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLAGA)

German title: Mechanische Normung von Halbleiterbauelementen - Teil 6-17: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für gestapelte Gehäuse - Feinraster-Ball- Grid-Array und Feinraster-Land-Grid-Array (P-PFBGA/P-PFLGA)
Publication date: 2011-01
Original language: English, French
Pages: 53

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Loading recommended items...