Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
German title
Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für Halbleiterbauelemente
Publication date
2013-10
Original language
English,
French
Pages
48
Publication date
2013-10
Original language
English,
French
Pages
48
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice
All transactions are encrypted
Replacement amendments
This document has been modified by: IEC 60191-4 AMD 1:2018-03