IEC 60068-2-69 AMD 1:2019-06

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

German title: Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung Te/TC: Prüfung der Lötbarkeit von Bauelementen der Elektronik und Leiterplatten mit der Benetzungswaage (Kraftmessung); Änderung 1
Publication date: 2019-06
Original language: English, French
Pages: 13

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