Printed board assemblies - Part 3: Sectional specification: Requirements for through-hole mount soldered assemblies (IEC 61191-3:1998)
German title
Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation: Anforderungen an gelötete Baugruppen in Durchsteckmontage (IEC 61191-3:1998)
Publication date
1998-10
Original language
English
Publication date
1998-10
Original language
English
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