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Standards Worldwide
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Standard [CURRENT]

DIN EN IEC 60749-37:2023-12

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes (IEC 60749-37:2022); Deutsche Fassung EN IEC 60749-37:2022
Publication date
2023-12
Original language
German
Pages
23

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Publication date
2023-12
Original language
German
Pages
23
DOI
https://dx.doi.org/10.31030/3447309

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ICS
31.080.01
DOI
https://dx.doi.org/10.31030/3447309
Replacement amendments

This document replaces DIN EN 60749-37:2008-08 .

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