Standards Worldwide
Standards Worldwide
Phone +49 30 58885700-07

Standard [CURRENT]

DIN EN 62435-5:2017-10

VDE 0884-135-5:2017-10

Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (IEC 62435-5:2017); German version EN 62435-5:2017

German title
Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 5: Chip- und Wafererzeugnisse (IEC 62435-5:2017); Deutsche Fassung EN 62435-5:2017
Publication date
2017-10
Original language
German
Pages
26

63.27 EUR VAT included

59.13 EUR VAT excluded

Format and language options

Shipment (3-5 working days)
  • 63.27 EUR

Monitor with the Standards Ticker

This option is only available after login.
Easily subscribe: Save time and money now!

You can also subscribe to this document - together with other important standards in your industry. This makes your work easier and pays for itself after a short time.

Sparschwein_data
Subscription advantages
Sparschwein Vorteil 1_data

Important standards for your industry, regularly updated

Sparschwein Vorteil 2_data

Much cheaper than buying individually

Sparschwein Vorteil 3_data

Useful functions: Filters, version comparison and more

Publication date
2017-10
Original language
German
Pages
26

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Overview

The economic service life of an electronic component is very short compared to the service life of industrial equipment, the service life of power generation and distribution applications or in transportation. Due to the diverse application of electronics in all areas and the rapid technical development, the obsolescence of electronic components, especially integrated circuits, has become increasingly important in recent years. In most cases, the solution to an emerging obsolescence problem is to systematically store the components. The technical risks of this solution are largely low a priori. However, it requires perfect control of the implemented process and especially of the storage conditions, whereby this solution becomes critical when long-term storage occurs. Long-term storage presupposes that components are stored for a number of years in a storage facility that cannot be interrupted. It is essential that the components are usable after storage. Particular attention shall therefore be paid to the storage media that exist around the components, together with the local environmental conditions. The application of the procedure proposed in this series of standards in no way guarantees that the stored components will be in perfect working order at the end of storage. It is only a means of minimizing potential and probable degradation factors, in particular humidity, electrostatic fields, ultraviolet light, large temperature fluctuations, air pollution and outgassing. This part of DIN EN 62435 (VDE 0847-35) covers chip and wafer products and includes the special storage organization and the conditions for individual bare chips and partial wafers or entire wafers with chips, which then also includes chips with additional structures such as redistribution layers, solder balls as well as solder bumps and other metallization. It also contains the special requirements for the primary packaging of chips or wafers during handling. The responsible committee is DKE/K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

Cooperation at DIN

Loading recommended items...
Loading recommended items...
Loading recommended items...
Loading recommended items...